Lead Frame Fixing Tape

The engineers at Tomoegawa USA Paper developed our advanced technology ELEPHANE R7 Series tape for fixing lead frame inner leads in DIP and QFP package applications. Inside of our R&D facility, they formulated an electrically insulative, non-conductive adhesive and applied it to a base polyimide film, then added a protective PET layer. Laminated on wide 35 mm – 1,400 rolls, it is slit to widths of 5 mm or greater in 0.1 mm increments, which enables us to achieve tight tolerance results. ELEPHANE R7 withstands the extremely high temperatures of IC package assembly, and it also adheres at low temperatures for thermosetting applications. In addition to its low ionic impurities, it also exhibits low out gassing and high electrical reliability.

Formulated to tolerate temperatures of 120°C-240°C, the flexibility of our manufacturing process allows us to adjust the parameters based on specific customer requirements. To learn more about this product, or our processes, and how they can benefit your semiconductor assembly operations, contact us today.

Lead Frame Fixing Tape Specifications

Product Name: ELEPHANE R7 Series

Product Description: Lead Frame Fixing Tape (Lead Lock Tape) / Electrical Insulating Tape

Project Scope: IC package mounting
Fixing Lead frames inner leads such as DIP and QFP.

Capabilities Applied/Processes: Non-Conductive Adhesive Development
High Clean Coating
Slitting
Laminating

Tightest Tolerances: Slitting the tape from min. 5mm width in units of 0.1mm.
Laminating the tape width between 35mm and 1,400mm.
Coating from 5μm thickness of adhesive on polyimide film.

Material Used: Polyimide Film
Non-Conductive Adhesive

Material Thickness

Type

Polyimide Film Base film
Thickness

Adhesive
Thickness

Protective Film
Thickness

R-722

Kapton200H
（50μm）

Heat Harding Type
（20μm）

>PET
（38μm）

R-970

Kapton200EN
（50μｍ）

Heat Harding Type
（20μｍ）

>PET
（25μm）

Temperature Range: 120℃～240℃
Parameters can be adjusted per customer's specification

Special Features

High Electric Insulation
High Electrical Reliability
Low Out Gassing
Low Ionic Impurities
Adhesive can endure extremely high temperatures during IC package assembling.
Ability to adhere at low temperatures for Thermosetting
Hardening adhesive is not necessary at the thermal process equipping ICs.

Industry for Use: Semiconductor Assembly

Delivery Location: United States, Japan